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4-Valve manifolds

MD41F 4-Valve manifold, F-type

4-Valve manifolds

MD41F 4-Valve manifold, F-type

The MD41F (Double Isolate, Equalize, Vent) is a ‘Flat model' manifold, used for mounting Direct mounted differential pressure instruments in full enclosures and heated assemblies like the modular body enclosure(BE1&BE2), CAB1, CAB2 GRP enclosures and PS-1 full enclosure system. Also in combination with coplanar style transmitters.
4-Valve manifolds

MD41H 4-Valve dp/Flow manifold, H-type

4-Valve manifolds

MD41H 4-Valve dp/Flow manifold, H-type

The MD41H (Double Isolate, Equalize, Vent) 4-valve dP/Flow manifold is mostly used for Shell MESC mounting style on a base plate or in heated assemblies like the modular body enclosure(BE1&BE2) and PS-1 full enclosure system.
4-Valve manifolds

MD42H 4-Valve Level manifold, H-type

4-Valve manifolds

MD42H 4-Valve Level manifold, H-type

The MD42H (Double Isolate, Double Vent) 4-valve Level manifold is mostly used for Shell MESC mounting style mounting on a base plate or in heated assemblies like the modular body enclosure(BE1&BE2) and PS-1 full enclosure system.
4-Valve manifolds

MD44H 4-Valve manifold, H-type

4-Valve manifolds

MD44H 4-Valve manifold, H-type

The MD44H (Double Isolate, Double Vent) 4-valve manifold is mostly used for mounting on a base plate or in heated assemblies like the modular body enclosure(BE1&BE2) and PS-1 full enclosure system.
4-Valve manifolds

MD41T 4-Valve dP/Flow manifold, T-type

4-Valve manifolds

MD41T 4-Valve dP/Flow manifold, T-type

The MD41T (Double Isolate, Equalize, Vent) 4-valve dP/Flow manifold is used for mounting coplanar style (integral mount) SHELL MESC transmitters on a base plate or in heated assemblies like the modular body enclosure(BE1&BE2) and PS-1 full enclosure system.
4-Valve manifolds

MD42T 4-valve Level manifold, T-type

4-Valve manifolds

MD42T 4-valve Level manifold, T-type

The MD42T (Double Isolate, Double Vent) 4-valve Level manifold is used for mounting coplanar style (integral mount) SHELL MESC transmitters on a base plate or in heated assemblies like the modular body enclosure(BE1&BE2) and PS-1 full enclosure system.
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